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Matias
MensajePublicado: Dom Dic 24, 2006 9:11 pm    Título del mensaje: Consulta sobre pastas termicas Responder citando



Registrado: 17 Abr 2006
Mensajes: 852
Ubicación: Montevideo, Uruguay

Bueno gente tengo la posibilidad de encargar estas pastas y no se cual es la mejor, que me recomiendan?


1-Compuesto Termoconductor ARCTICSILVER Céramique 2,5g

The high-density, ceramic-based thermal compound specifically designed for modern high-power CPUs and high-performance heatsinks or water-cooling solutions. The Evolution of Cool!

Features:

High-Density ceramic content:
Ceramique uses a high-density layered composite of five unique shapes of thermally conductive aluminum oxide, boron nitride and zinc oxide sub-micron particles to maximize particle-to-particle contact area and thermal transfer. This exclusive combination provides performance exceeding most metal based compounds.

Controlled Triple-Phase Viscosity:
Ceramique does not contain any silicone.

The suspension fluid is a proprietary mixture of advanced polysynthetic oils that provide superior performance and long-term stability.

During the system's initial use, the heat from the CPU lowers the viscosity of the compound to enhance the filling of the microscopic valleys and ensure a minimum bond line between the heatsink and the CPU core. Then the compound thickens slightly over the next 100 to 300 hours of use to its final consistency designed for long-term stability.
(This should not be confused with conventional phase change pads that are pre-attached to many heatsinks. Those pads melt each time they get hot then re-solidify when they cool. The viscosity changes that Ceramique goes through are much more subtle and ultimately much more effective.)

Excellent Stability:
Ceramique is engineered to not separate, run, migrate, or bleed.

Electrical Insulator:
Ceramique does not contain any metal or other electrically conductive materials. It is a pure electrical insulator, neither electrically conductive nor capacitive.

Performance:
2 to 10 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.

Easy Clean Up:
Ceramique can easily be cleaned from CPUs and heatsinks with isopropyl alcohol or any of the cleaners listed in the product instructions.

Innovative Dispenser:
The 2.5-gram Ceramique is the first product available in our proprietary thermal compound syringe. Our new syringe is more compact, easier to handle and dispenses a higher percentage of its content than standard industrial or medical syringes. The amount of compound remaining in the syringe is easy to determine as the rear of the plunger is perfectly flush with the flange when the syringe is empty.



Specifications:


Thermal Resistance:
<0.007°C-in2/Watt (0.001 inch layer)

Thermal Conductance:
>200,000W/m2.°C (0.001 inch layer)

Average Particle Size:
<0.38 microns <0.000015 inch
( 67 particles lined up in a row equal 1/1000th of an inch. )

Temperature limits:
Peak: –150°C to >180°C   Long-Term: –150°C to 125°C

Coverage Area:
2.5-gram syringes. (About 1cc)
At a layer 0.003" thick, one tube will cover approximately 20 square inches.

22-gram syringes. (About 8cc)
At a layer 0.003" thick, one tube will cover approximately 160 square inches.

Important Reminder:

Due to the unique shapes and sizes of the particles in Ceramique, it will take a minimum of 25 hours and several thermal cycles to achieve maximum particle to particle thermal conduction and for the heatsink to CPU interface to reach maximum conductivity. (This period will be longer in a system without a fan on the heatsink.) On systems measuring actual internal core temperatures via the CPU's internal diode, the measured temperature will often drop slightly over this "break-in" period. This break-in will occur during the normal use of the computer as long as the computer is turned off from time to time and the interface is allowed to cool to room temperature. Once the break-in is complete, the computer can be left on if desired.


2-Compuesto Termoconductor ARCTICCOOLING MX-1 2g


No metal particles

Since the MX-1 does not contain any metal particles, there are no problems regarding electrical conductivity and capacitance. In contrast to silver and copper compounds, contact to electrical traces, pins, and leads cannot result in any damage.

Durability

The compound hardens within a period of 200 hours and reaches thereafter its optimum performance. Because of the hardened compound, no evaporation or bleeding is possible. In contrast to metal or silicon pastes, this compound does not show decreasing performance over time, does not need to be reapplied and has a durability of at least 8 years.

-

Viscosity:   1700 Poise
Working Temperature:   -50°C to 170°C
Density:   2.4 g/ml
Net Weight:   2 g

3-Silicona Termoconductora ARCTICSILVER 5 3,5g

Introducing Arctic Silver 5 With its unique high-density filling of micronized silver and enhanced thermally conductive ceramic particles, Arctic Silver 5 provides a new level of performance and stability. Now available at Arctic Silver dealers worldwide, Arctic Silver 5 is definitely The New Reference.

Arctic Silver 5 is optimized for use between modern high-power CPUs and high performance heatsinks or water-cooling solutions.

Features:

Contains 99.9% pure silver:
Arctic Silver 5 uses three unique shapes and sizes of pure silver particles to maximize particle-to-particle contact area and thermal transfer.

High-Density:
Arctic Silver 5 contains over 88% thermally Conductive filler by weight. In addition to micronized silver, Arctic Silver 5 also contains sub-micron zinc oxide, aluminum oxide and boron nitride particles. These thermally-enhanced ceramic particles improve the compound's performance and long-term stability.

Controlled Triple-Phase Viscosity:
Arctic Silver 5 does not contain any silicone. The suspension fluid is a proprietary mixture of advanced polysynthetic oils that work together to provide three distinctive functional phases. As it comes from the tube, Arctic Silver 5's consistency is engineered for easy application. During the CPU's initial use, the compound thins out to enhance the filling of the microscopic valleys and ensure the best physical contact between the heatsink and the CPU core. Then the compound thickens slightly over the next 50 to 200 hours of use to its final consistency designed for long-term stability.
(This should not be confused with conventional phase change pads that are pre-attached to many heatsinks. Those pads melt each time they get hot then re-solidify when they cool. The viscosity changes that Arctic Silver 5 goes through are much more subtle and ultimately much more effective.)

Not Electrically Conductive:
Arctic Silver 5 was formulated to conduct heat, not electricity.
(While much safer than electrically conductive silver and copper greases, Arctic Silver 5 should be kept away from electrical traces, pins, and leads. While it is not electrically conductive, the compound is very slightly capacitive and could potentially cause problems if it bridges two close-proximity electrical paths.)

Absolute Stability:
Arctic Silver 5 will not separate, run, migrate, or bleed.



Thermal Compound Review
The most comprehensive thermal
compound comparisons published.
Just to put things in perspective.
The Comparison at The Tech Zone
(Includes the original Arctic Silver)

Reviews of Arctic Silver 5


Microbits (Translated to English)

Gruntville

PCSynapse

Techware Labs

Xtreme Systems

SL Central

Modsynergy

Short-Media

Overclokking.no

ksbrainstorms

HKEPC (Chinese)


Link to reviews of previous versions of Arctic Silver

Resellers and Distributors
U.S.A
International

Instructions
Thermal Compound Instructions

MSDS (PDF File)
Arctic Silver 5 MSDS Sheet

Specifications:

Thermal Conductance:
>350,000W/m2 °C (0.001 inch layer)

Thermal Resistance:
<0.0045°C-in2/Watt (0.001 inch layer)

Average Particle Size:
<0.49 microns <0.000020 inch

Extended Temperature Limits:
Peak: –50°C to >180°C Long-Term: –50°C to 130°C

Performance:
3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.

Coverage Area:
Arctic Silver 5 is sold in 3.5 gram and 12 gram tubes. The 3.5 gram tube contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram tube will cover approximately 16 square inches.

Important Reminder:
Due to the unique shape and sizes of the particles in Arctic Silver 5's conductive matrix, it will take a up to 200 hours and several thermal cycles to achieve maximum particle to particle thermal conduction and for the heatsink to CPU interface to reach maximum conductivity. (This period will be longer in a system without a fan on the heatsink or with a low speed fan on the heatsink.) On systems measuring actual internal core temperatures via the CPU's internal diode, the measured temperature will often drop 2C to 5C over this "break-in" period. This break-in will occur during the normal use of the computer as long as the computer is turned off from time to time and the interface is allowed to cool to room temperature. Once the break-in is complete, the computer can be left on if desired.


Caution:
We do not recommend using Arctic Silver 5 on the older slot type Intel Xeon processors with large multiple square inch CPU to heatsink interfaces. The huge contact area and large gaps between the processor and the heatsink require a thermal pad or thick mesh-reinforced paste. Arctic Silver 5 can be used on socket type Xeons without a problem.

Bueno, disculpen si me extendi demaciado Very Happy , salu2
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elninio_
MensajePublicado: Jue Ene 11, 2007 2:16 pm    Título del mensaje: Responder citando



Registrado: 27 Nov 2006
Mensajes: 599
Ubicación: Vicente lopez!

x lo q lei.. la mejor es la 2da... a mi parecer... x ahi en la teoria todo muy lindo.. pero quiza otra da mejor resultado.. para q la vas a usar?
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Matias
MensajePublicado: Jue Ene 11, 2007 5:39 pm    Título del mensaje: Responder citando



Registrado: 17 Abr 2006
Mensajes: 852
Ubicación: Montevideo, Uruguay

Pues para todo Razz osea cpu vga y nb. ¿cambia en algo?
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elninio_
MensajePublicado: Vie Ene 12, 2007 10:03 am    Título del mensaje: Responder citando



Registrado: 27 Nov 2006
Mensajes: 599
Ubicación: Vicente lopez!

pero yo me referia... si lo vas a meter en el sistema de WC q tenes..
_________________
Intel i7 920 @ 3.2Ghz
ASUS P6T Deluxe
3x 2Gb G.Skill [PK] DDR3 @ 1600Mhz
ASUS GTX295
WD VelociRaptor 300Gb
Dell 24' 2408WFP
Microsoft Reclusa
Logitech MX518 Gamer Edition
OCZ Behemot
CM Real Power 1000w
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Matias
MensajePublicado: Vie Ene 12, 2007 1:00 pm    Título del mensaje: Responder citando



Registrado: 17 Abr 2006
Mensajes: 852
Ubicación: Montevideo, Uruguay

elninio_ escribió:
pero yo me referia... si lo vas a meter en el sistema de WC q tenes..


Si si, a todo! Very Happy
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elninio_
MensajePublicado: Vie Ene 12, 2007 1:05 pm    Título del mensaje: Responder citando



Registrado: 27 Nov 2006
Mensajes: 599
Ubicación: Vicente lopez!

corrijo mi primera opinion... la 3era pasta... sale como patada de ninja!
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Intel i7 920 @ 3.2Ghz
ASUS P6T Deluxe
3x 2Gb G.Skill [PK] DDR3 @ 1600Mhz
ASUS GTX295
WD VelociRaptor 300Gb
Dell 24' 2408WFP
Microsoft Reclusa
Logitech MX518 Gamer Edition
OCZ Behemot
CM Real Power 1000w
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